Fujifilm announced on 14 October 2026 that it is enhancing production facilities for copper-interconnect chemical mechanical planarization (CMP) slurries at its Mesa, Arizona site.
The company will also establish new production facilities capable of multiproduct manufacturing of CMP slurries for diversified semiconductor manufacturing processes, including advanced packaging applications.
The investment totals USD 18 million, approximately 3 billion yen.
The expansion responds to growing demand for specialty electronic chemicals used in semiconductor fabrication and advanced packaging.
CMP slurries are a key consumable in wafer processing and packaging.
